India Gets ₹1 Lakh Cr Investment Commitments Under Semicon 2.0: Vaishnaw

India has secured around ₹1 Lakh Cr in investment commitments from players in capital equipment, materials, specialty gases, and advanced packaging under Semicon 2.0 since its launch, said Vaishnaw at Semicon India 2026 The second phase of India’s semiconductor policy framework could create close to 1 Lakh new jobs and entails an outlay of ₹1.28 Lakh Cr Vaishnaw said that Semicon 2.0’s roadmap rests on six core pillars: chip design, equipment and raw materials, fabs, advanced packaging, R&D, and talent Under the recently approved Semicon 2.0 mission, the Central government is seeing investment commitments worth approximately ₹1 Lakh Cr ($11-12 Bn), union minister Ashwini Vaishnaw said during his address at Semicon India 2026. Global players across capital equipment, materials, specialty gases, and advanced packaging have pledged to deploy this capital over the next 2-3 years as India scales up its domestic electronics value chain, the minister said. The estimates are based on the minister’s discussions with the companies, some of whom are yet to make their investment plans public. Notably, US-based semiconductor company Applied Materialsannounced a $5 Bn (about ₹48,000 Cr) investment commitmentearlier today. Vaishnaw also highlighted that the government would be targeting at least 200 startups and companies operating under the Semicon 2.0. Under the initial phase of the mission, Vaishnaw said that more than 105 startups attempted chip design, of which about 20 secured venture capital funding worth around ₹800 Cr. “Semicon 1.0 was all about setting the foundation and making sure that we learned to walk. Semiconductor 2.0 is more aboutgetting the ecosystem in place,” said Vaishnaw. The first phase of the India Semiconductor Mission (Semicon 1.0) was approved with an outlay of ₹76,000 Cr in December 2021. Under the mission, 12 semiconductor manufacturing units were approved, carrying a cumulative investment of over ₹1.64 Lakh Cr. In July 2026, India approved Semicon 2.0 with atotal outlay of ₹1.28 Lakh Cr. With the Semicon 2.0, eligible semiconductor startups and MSMEs can get up to ₹15 Cr in seed funding, along with equity co-investment support for companies backed by VC or PE investors. Deployment-linked incentives will also be available for semiconductor IPs, chips and SoCs launched after the scheme’s announcement. The scheme will provide fiscal support for semiconductor fabs and advanced packaging facilities. Silicon wafer fabs with at least ₹20,000 Cr investment will qualify for support of up to 40% of eligible capex, while compound semiconductor, photonics, sensor and discrete fabs will also be eligible. Advanced packaging projects, including 2.5D/3D packaging, wafer-level chip-scale packaging and heterogeneous integration, will also receive support, alongside R&D facilities for semiconductor equipment, raw materials and testing infrastructure. The Semicon 2.0’s roadmap rests on six core pillars: developing the chip design ecosystem, equipment